铟泰公司将在 IPC APEX 博览会上分享电动汽车产品

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• Source: Indium
• Date: 2022-01-11
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(SMT专业网译）

Indium Corporation 将于 1 月 25 日至 27 日在美国加利福尼亚州圣地亚哥举行的 IPC APEX 博览会上展示其经过验证的电动汽车 (EV) 制造创新解决方案套件。



如今，超过 200 万辆电动汽车正在上路，采用 Indium Corporation 的 Rel-ion™ 电动汽车电气、机械和热解决方案套件。这些可靠、可扩展且经过验证的材料旨在提高可靠性，不会对模块、组件或系统造成零公里故障。参加 IPC APEX 博览会，了解以下经过验证的产品：

Durafuse™ LT，一种正在申请专利的低温合金系统，旨在为需要在 210°C 以下回流的低温应用提供高可靠性。传统的低温焊料会产生易受跌落冲击故障影响的脆性焊点，而 Durafuse™ LT 提供卓越的跌落冲击弹性，优于 BiSn 或 BiSnAg 合金，并且在优化工艺设置下性能优于 SAC305。

这项经过验证的技术支持汽车电气化的挑战，并通过以下方式帮助提高可靠性：
·为热敏元件和柔性聚合物提供解决方案
· 防止处理器组件和多层板的热翘曲
·满足阶梯焊接的低温要求，特别是在射频屏蔽连接、底部填充后工艺和返工应用中
Indium8.9HF 焊膏是一种经过行业验证的焊膏，可提供免清洗、无卤素的解决方案，旨在为高可靠性汽车电子产品在印刷过程中产生低空洞、增强电气可靠性和稳定性。

铟泰8.9HF：
·通过增强表面绝缘电阻 (SIR) 提高电气可靠性，抑制电流泄漏和枝晶生长
·确保底部端接元件（例如 QFN、DPAK、LGA）的低空洞率

通过以下方式提供最高的产品稳定性：

• 出色的暂停响应，即使在模板上放置 60 小时后也是如此
• 在室温下放置 1 个月后提高印刷和回流性能
• 冷藏时长达 12 个月的一致打印性能

• 提供出色的引脚焊膏和通孔可焊性
• 防止助焊剂过早扩散以防止表面氧化
• 适用于有铅和无铅合金

要了解有关 Indium Corporation 用于 EV 和其他汽车应用的成熟产品的更多信息，请在展会期间访问该公司的展位 #3046，或访问 indium.com/auto。

 

Indium Corporation to Share Products for EV at IPC APEX Expo

Indium Corporation will feature selections from its suite of proven innovative solutions for electric vehicle (EV) manufacturing at IPC APEX Expo, Jan. 25-27, San Diego, Calif., U.S.

 

More than two million EVs are on the road today with the Rel-ion™ suite of electrical, mechanical, and thermal solutions for e-mobility by Indium Corporation. These reliable, scalable, and proven materials are designed to increase reliability with no zero km failures to modules, components, or systems. Attend IPC APEX Expo to see the following proven products:

Durafuse™ LT, a patent-pending low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse™ LT provides superior drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.

This proven technology supports the challenges of automotive electrification and helps deliver enhanced reliability by:

• Providing a solution for heat-sensitive components and flex polymers
• Preventing thermal warpage of processor components and multilayer boards
• Meeting low-temperature requirements for step soldering, particularly in RF shield attachment, post underfill processes, and rework applications

Indium8.9HF Solder Paste is an industry-proven solder paste that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process for high-reliability automotive electronics.

Indium8.9HF:

• Increases electrical reliability via enhanced surface insulation resistance (SIR) that inhibits current leakage and dendritic growth
• Ensures low-voiding on bottom termination components (e.g., QFN, DPAK, LGA)
• Delivers supreme product stability with:
  • Excellent response-to-pause, even after being left on the stencil for 60 hours
  • Enhanced printing and reflow performance after remaining at room temperature for one month
  • Consistent printing performance for up to 12 months when refrigerated
• Offers excellent pin-in-paste and through-hole solderability
• Resists premature flux spread to prevent surfaces from oxidizing
• Performs with both Pb and Pb-free alloys.

To learn more about Indium Corporation’s proven products for EV and other automotive applications, visit the company during the show at booth #3046, or go to indium.com/auto.