Indium Corporation 在 CIPS 展示用于电力电子的高可靠性产品

• 作者:
• 来源: Indium
• 日期: 2022-03-04
• 浏览次数: 1274次

Indium Corporation 在 CIPS 展示用于电力电子的高可靠性产品
Indium Corporation 将于 3 月 15 日至 17 日在德国柏林举行的集成电力电子国际会议 (CIPS) 上展示其电力电子高可靠性解决方案组合中的精选产品。



由于汽车、运输、计算和能源基础设施等多个行业对电力电子系统的需求不断增长，Indium Corporation 是电力电子组装材料的领导者。 Indium Corporation 继续为当前和新兴的电力电子挑战提供经过验证的高可靠性材料解决方案。

Indium Corporation 的 InFORMS® 预成型焊料不仅仅是粘合两个表面——它们旨在解决电力电子行业的特定挑战。 InFORMS® 是一种具有增强基体的复合焊料。结果是：

均匀的胶层厚度
提高机械和热可靠性
用成熟的工艺代替传统的瓶坯

InFORMS® 为工程师提供增强材料，以开发更可靠和更高性能的模块。由于改进的平面度和间距公差，封装设计变得更加可预测。此外，更坚固、更可靠的接头可实现高功率密度。

欲了解更多信息，请访问展会上的 Indium Corporation 专家。

关于铟泰公司
Waypoint Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料精炼厂、冶炼厂、制造商和供应商。产品包括焊料和助焊剂；钎焊；热界面材料；溅射靶材；铟、镓、锗和锡金属和无机化合物；和 NanoFoil®。公司成立于1934年，在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国拥有全球技术支持和工厂。

有关铟泰公司的更多信息，请访问 www.indium.com 或发送电子邮件至 jhuang@indium.com。您还可以在 www.linkedin.com/company/indium-corporation/ 或 @IndiumCorp 关注我们的专家 From One Engineer To Another® (#FOETA)。

关于 CIPS
未来几十年，电力电子系统的发展将以节能系统、智能能源管理、电能质量、系统小型化和高可靠性为驱动力。单片和混合系统集成将包括先进的设备概念，例如宽带隙设备、新封装技术和整体执行器/驱动器集成——机电一体化。
因此，CIPS主要关注以下几个方面：
· 电力电子器件和转换器的组装和互连技术
· 高功率密度混合系统与机电一体化系统的集成
· 系统和组件的运行行为和可靠性


Indium Corporation Features High-Reliability Products for Power Electronics at CIPS
Indium Corporation will feature selections from its portfolio of high-reliability solutions for power electronics at the International Conference on Integrated Power Electronics (CIPS), March 15-17 in Berlin, Germany.



Indium Corporation is the leader in power electronics assembly materials as a variety of industries—including automotive, transportation, computing, and energy infrastructure—demand more from power electronics systems. Indium Corporation continues to deliver proven high-reliability material solutions to current and emerging power electronics challenges.

Indium Corporation’s InFORMS® solder preforms do more than just bond two
surfaces—they are designed to address specific challenges for the power electronics
industry. InFORMS® are a composite solder material with a reinforcing matrix. This
results in:

• Uniform bondline thickness
• Improved mechanical and thermal reliability
• Drop-in alternative to traditional preforms leveraging proven processes

InFORMS® provide engineers with an enhanced material for the development of more
reliable and higher performance modules. Due to the planarity improvements and stand-
off tolerances, the package design becomes more predictable. In addition, stronger and
more dependable joints allow for high power densities.

For more information, visit Indium Corporation’s experts at the show.

About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

About CIPS
In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization, and high-reliability. Monolithic and hybrid system integration will include advanced device concepts, (e.g. wide bandgap devices, new packaging technologies, and the overall integration of actuators/drives—mechatronic integration).
CIPS is consequently focused on the following main aspects:
· Assembly and interconnect technology for power electronic devices and converters
· Integration of hybrid systems and mechatronic systems with high power density
· Systems’ and components’ operational behavior and reliability