麦德美爱法发布新一代低熔点锡膏ALPHA® OM-565 HRL3

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• 来源: 麦德美爱法
• 日期: 2022-03-11
• 浏览次数: 1263次

(Waterbury, CT USA) – 2022年3月10日 – 麦德美爱法是结合电子线路、电子组装和半导体封装解决方案的全球供应商，我们提供的制程解决方案能帮助制造商客户达成无与伦比的电子设计和制造能力。麦德美爱法宣布推出 ALPHA OM-565 HRL3，这是新一代高可靠性低温锡膏，针对多种组装而设计，以减少在温度敏感的芯片封装中因翘曲而引起的缺陷。



ALPHA OM-565 HRL3 锡膏旨在实现目标回流温度175 °C同时具有出色的润湿性，可最大程度地减少回流中产生的非润湿开焊(NWO)和头枕(HiP)等缺陷。HRL3合金与现有的低温解决方案相比有着更出色的热机械性能和耐跌落冲击性能。ALPHA OM-565 的化学成分提高了现有低温焊料的电化学性能，在接触返工应用中与经 ALPHA 测试的有芯锡丝和返工用助焊剂配合使用时，体现了良好的兼容性。

SMT全球产品组合经理, Paul Salerno说: “HRL3 合金代表著麦德美爱法致力于提供创新的低温合金解决方案以满足下一代电子组装需求。ALPHA OM-565 HRL3 能够降低峰值回流温度和最大程度地减少翘曲引起的缺陷，并提高需要更大和更薄封装设计组件的机械可靠性，这些封装设计在最新的手持設備和電子计算应用中变得普遍。”

ALPHA HRL3 合金亦有提供固态焊料，包括用于选择性焊接和浸焊工艺的锡条和锡丝。

如欲了解更多关 ALPHA OM-565 HRL3 锡膏 和 ALPHA HRL3 固态焊料, 请造访macdermidalpha.com

关于麦德美爱法 (MacDermid Alpha Electronics Solutions)
通过我们的Alpha, Compugraphics, Electrolube, Kester和MacDermid Enthone 品牌组织针对化学品和材料产品的不断创新，我们提供电子互连设备与产品的制程解决方案。 我们的服务遍布全球所有地区以及每一个电子产品制造供应链。结合我们的半导体，电路板和组装解决方案部门的专家团队在设计，实施和技术服务协同合作，以确保我们的合作伙伴客户取得成功。我们的解决方案帮助客户实现高生产率和缩短制造的周期时间以及成就非凡的电子设备及产品。


MacDermid Alpha Launches ALPHA® OM-565 HRL3, Next Generation, Low Melt Point Solder Paste
(Waterbury, CT USA) – March 10th, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, announces the launch of ALPHA OM-565 HRL3, next generation, high reliability low temperature solder paste formulated for a broad range of assemblies to mitigate warpage induced defects in temperature sensitive chip-scale packages.



ALPHA OM-565 HRL3 solder paste is designed to enable target reflow temperatures of 175 °C with superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HiP). The HRL3 alloy offers superior thermomechanical and drop shock performance compared to existing low temperature solutions. The ALPHA OM-565 chemistry enhances electrochemical performance over existing low temperature solders, providing excellent compatibility in contact rework applications with ALPHA tested cored wire and rework fluxes.

“The HRL3 alloy represents MacDermid Alpha’s commitment to providing innovative low temperature alloy solutions to meet next generation electronic assembly needs”, comments Paul Salerno, Global Portfolio Manager, SMT. “ALPHA OM-565 HRL3 enables lower peak reflow temperatures, minimizes common warpage induced defects, and enhances mechanical reliability in assemblies requiring larger, thinner form factor package designs that are becoming common in the latest handheld and computing applications.”

The ALPHA HRL3 alloy is also available in solid solder formats including bar solder and wire for selective and dip soldering processes.

For more information on ALPHA OM-565 HRL3 Solder Paste and ALPHA HRL3 Solid Solder please visit macdermidalpha.com

About MacDermid Alpha Electronics Solutions:
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Assembly Solutions, Semiconductor Solutions, and Circuitry Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.