- Author:
- Source: MW Associates
- Date: 2022-07-23
- Views: 1577Times
NORTH BILLERICA, Mass., July 2022 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced that it was awarded two 2022 EM Innovation Awards. The company was awarded in the categories of Soldering – Auxiliary Systems for its Trueflat Technology and Selective Soldering for its Valence 3508 selective soldering system. With these two awards, the company marks 51 industry awards for its thermal processing equipment.
Trueflat technology is an optional configuration of the PYRAMAX™ convection reflow oven. Designed for substrate thicknesses of 0.15 to 0.30mm, TrueFlat technology ends die tilt. The result is consistent and repeatable flatness, and superior thermal uniformity due to the PYRAMAX’s closed-loop convection heating.
The PYRAMAX with TrueFlat technology does not impact reflow oven footprint, making it easy to transition from existing reflow processes. Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary WINCON™ Windows-based software including factory host/MES interface for Industry 4.0 compliance.
The Valence 3508 was designed for high mix, high-volume, high-level PCB production. The continuous duty, multi-station, in-line selective soldering machine utilizes an electromagnetic pump. The Valence 3508 can be programmed in minutes and is highly configurable and customizable. With a three-shift processing area and stainless-steel ball screws, the Valence 3508 selective soldering system increases production efficiency and reduces downtime associated with maintenance.
Established in 2006, the EM Innovation Awards program strives to recognize and celebrate excellence in the Asian electronics industry, inspiring companies to achieve the highest standards and push the industry forward.
To learn more, visit www.btu.com.
About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.
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