- 来源: MW Associates
- 日期: 2023-02-28
- 浏览次数: 76次
Steven Wongsonvanee, Pemtron General Manager – Americas, will be available to meet with customers to discuss its Saturn 3D Inline Solder Paste Inspection System, Athena 3D Automated Optical Inspection System, TWIN 3D Automated Optical Inspection System, TROI 8800 CI Series Conformal Coating Inspection System and Mercury Automated X-ray SMD Counter.
Also on the AOI side, Pemtron offers the TWIN 3D AOI system for top/bottom double-sided simultaneous inspection. Pemtron’s new head type has been upgraded for 3D formation that is identical to the real image and is more stable.
Pemtron’s Saturn 3D Inline Solder Paste Inspection (SPI) System features Moiré technology, combining 2D color images with 3D measurement data. The result is more accurate and realistic 3D inspection images unlike conventional methods that display the solder paste through a color map only. With quad projection, 10/15 or 18um resolution a 4MP camera (optional 10MP) and three-stage conveyor (rail extensions optional), the Saturn is the most advanced 3D SPI system.
Pemtron’s TROI 8800 CI Series Conformal Coating Inspection System with optional inline Coating Thickness Measure provides the most reliable conformal coating inspection. With simple programming, the machine can inspect defects like cracks, coating voids, wrong coating thickness (too-thin or too-thick).
The Mercury Automated X-ray SMD Counter provides real-time data with Artificial Intelligence. The system offers a reel capacity of up to four 7” reels or a single 13” reel, a scanner and label printer interface, real-time ERP reporting and annual stock through barcode monitoring.
For more information about Pemtron, visit https://pemtron.com/.
Based on 3D precision measurement and vision source technology, Pemtron develops equipment
used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies
Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI),
Wafer Bump 3D Inspection equipment, Wire Bonding 3D Inspection equipment, and Lead Tab Process/Inspection equipment.
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