SHENMAO Debuts High Thermal Impact Reliability No-Clean Solder Paste PF918-P250,

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• Source: MW Associates
• Date: 2023-12-15
• Views: 2007Times

SHENMAO Debuts High Thermal Impact Reliability No-Clean Solder Paste PF918-P250, Elevating Automotive Electronics Performance
 

SAN JOSE, CA ― December 2023 ― SHENMAO Technology proudly unveils its latest innovation, the PF918-P250 no-clean solder paste, specifically designed to meet the stringent demands of automotive applications. With a focus on enhancing thermal impact reliability, PF918-P250 sets a new standard for performance, delivering superior results for automotive devices and high-power components. 

 

SHENMAO's PF918-P250 is the result of a dedicated effort to provide a cutting-edge solder paste solution tailored for automotive applications. The solder paste features a high-reliability lead-free alloy (Sn/4Ag/3Bi), showcasing a tensile strength performance that is 1.4 times greater than the typical SAC305 alloy. This makes PF918-P250 ideal for applications where thermal cycling reliability is crucial, such as in automotive devices and high-power components. Board-level thermal cycling tests conducted with real automotive IC products demonstrate that PF918-P250 boasts a thermal cycling life that is 2X longer than the SAC305 alloy, underscoring its exceptional durability and reliability.

 

A. Halogen-Free Compliance: PF918-P250 is halogen-free (ROL0) with no intentional addition of halogens, ensuring compliance with RoHS, RoHS 2.0, and REACH regulations.

B. Innovative Flux Design: The solder paste incorporates an innovative flux design, allowing for easy void control, achieving levels as low as 5 percent on QFN and MOS components.

C. Enhanced Thermal Reliability: PF918-P250 delivers a minimum 30 percent increase in thermal reliability performance, making it an ideal choice for applications with demanding thermal requirements.

D. SAC305 Compatibility: With a similar melting point to SAC305, PF918-P250 allows for the application of regular SAC305 reflow profiles, simplifying the integration process.

E. Optimal Solderability and Printability: PF918-P250 exhibits excellent solderability and printability, ensuring ease of use in manufacturing processes.

PF918-P250 is versatile and applicable to a range of high-reliability electronic products. While it is particularly well-suited for automotive electronics, it also finds utility in consumer electronics, servers, and long-service-life electronic products. The solder paste's exceptional thermal reliability performance makes it a preferred choice for industries where reliability is paramount.
 

For more information, please visit www.shenmao.com. 

 

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About SHENMAO

SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.