• Author:
• Source: MW Associates
• Date: 2024-10-08
• Views: 272Times

October 2024 ― PEMTRON, an inspection equipment developer and supplier, is pleased to announce that it will be exhibiting its innovative D2 (Dual Lane & Dual Head) Series at SMTA Tijuana, scheduled to take place Nov. 7, 2024 at the Quartz Hotel Tijuana. The D2 System is revolutionizing the field of Solder Paste Inspection (SPI) with its industry-leading dual lanes and dual heads feature, allowing for the simultaneous inspection of two different PCBs. This cutting-edge technology dramatically enhances productivity and throughput, making it a vital tool for high-demand manufacturing environments.

The D2 System’s exceptional versatility is demonstrated through its ability to handle a variety of board configurations, including 8way + 4way, 12way + 4way, and 8way + 8way. This capability sets new standards for efficiency and flexibility, offering manufacturers a comprehensive inspection solution that meets diverse production needs. Additionally, the system is equipped with tele-centric lenses, high-speed CPUs, and advanced image processing technology, ensuring precise and reliable operation.

With a built-in library management system and an offline real-time debug station, the D2 System enhances user experience, making it easier to manage and adjust inspection processes. Its customizable design allows for tailored solutions, ensuring that manufacturers can meet specific production requirements with ease.

Visit PEMTRON at SMTA Tijuana to experience the future of SPI and discover how the D2 System can transform your inspection capabilities. For more information about PEMTRON, please visit www.pemtron.com.

About PEMTRON

Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies

Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS),  FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) an