• Author:
• Source: MW Associates
• Date: 2025-03-24
• Views: 73Times

CONTACT

SHENMAO America, Inc.

Watson Tseng, General Manager

E-mail: watson_tseng@SHENMAO.us

SHENMAO PF925 High-Reliability Solder Provides Superior Strength and Hot-Tearing Resistance

SAN JOSE, CA ― March 2025 ― SHENMAO America, Inc. continues to advance soldering solutions with its PF925 High-Reliability Solder, designed to improve mechanical strength, thermal stress resistance, and defect prevention in high-reliability electronics manufacturing. The PF925 alloy enhances solder joint integrity through dispersion strengthening, solid solution strengthening, and inhibition of brittle intermetallic compound (IMC) growth, ensuring long-term durability in demanding applications. 

The dispersion strengthening mechanism in PF925 forms intermetallic compounds (IMCs) such as Ag₃Sn and Cu₆Sn₅, reinforcing the solder matrix for improved mechanical properties. Additionally, the solid solution strengthening effect, achieved by introducing solute atoms, creates localized stress fields that restrict dislocation movement, further enhancing the material’s overall strength. To combat the risks associated with brittle IMC growth, PF925 minimizes Kirkendall void formation, which can lead to brittle interfacial fractures in solder joints.

In addressing hot tearing defects, SHENMAO developed PF925 with a narrow pasty range (TL-TS = 2°C), ensuring better thermal stress resistance and preventing joint separation during cooling. This near-eutectic composition allows solder joints to solidify more uniformly, reducing stress and improving overall reliability.

PF925-P250, an advanced formulation of the PF925 alloy, offers additional benefits, including halogen-free compliance (ROL0) with full RoHS, RoHS 2.0, and REACH certification. Its specially formulated flux minimizes voiding in BGAs, QFNs, and MOS components, while its excellent solderability and wettability provide strong, consistent bonding.

Developed with Panasonic’s patented Sn-Ag-Cu-In-Bi alloy, PF925-P250 delivers superior thermal stress resistance and crack prevention in solder joints. The inclusion of Indium (In) and Bismuth (Bi) strengthens the Sn matrix, resulting in improved reliability compared to standard SAC solders, while also lowering the melting point for better processing performance.

With its unique alloy composition and advanced strengthening mechanisms, PF925 is an ideal solution for SMT processes that demand exceptional durability and long-term reliability.

For more information on SHENMAO’s PF925 solutions, visit www.SHENMAO.com. 

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About SHENMAO

SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.