SHENMAO Technology, Inc. Launches SMF-TA52, a Zero-Residue Transient Adhesive De

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• Source: MW Associates
• Date: 2025-12-11
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CONTACT

SHENMAO America, Inc.

Andy Chueh, Director

E-mail: andy_chueh@shenmao.us 

 

SHENMAO Technology, Inc. Launches SMF-TA52, a Zero-Residue Transient Adhesive Designed for Formic Acid Reflow

SAN JOSE, CA ―December 2025 ― SHENMAO Technology, Inc. has introduced its new SMF-TA52 transient adhesive, a material created specifically for the growing use of formic acid reflow soldering in semiconductor packaging and other high-reliability electronics. 

Formic acid reflow is gaining traction because it removes the need for traditional flux. By using formic acid as the reducing agent, the process clears metal oxides during heating and produces clean, low-void solder joints with no residue left behind. This makes it a good fit for applications that cannot tolerate contamination, such as automotive power devices (IGBTs, MOSFETs, diodes), copper pillar bumping, SiP modules, and packages that need strong thermal performance.

A Material Built for the Process

The new SMF-TA52 adhesive was formulated to hold solder preforms, dies, and wafers in place during assembly without interfering with the reduction chemistry inside the reflow oven. As the temperature rises, the adhesive breaks down gradually and reaches zero residue at peak reflow, eliminating any need for cleaning afterward.

SMF-TA52 is SVHC-free, halogen-free, and no-clean, aligning with the strict material requirements common in advanced semiconductor and power-module manufacturing.

Key Advantages

• Works with formic acid reflow, vacuum reflow, and silver sintering
• Provides strong, stable adhesion with a longer open time
• Suitable for both dispensing and jetting
• Leaves no residue after reflow
• Meets global environmental and regulatory expectations

SHENMAO continues to expand its materials portfolio for semiconductor packaging as manufacturers look for cleaner processes, tighter tolerances, and more reliable thermal performance. SMF-TA52 gives engineers a purpose-built adhesive that fits directly into those requirements.

To learn more about SHENMAO’s high-performance solder materials, visit www.SHENMAO.com. 

 

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About SHENMAO

SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.