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• Source: MW Associates
• Date: 2026-04-30
• Views: 76Times

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PEMTRON Corporationsales@pemtron.com

PEMTRON Connects X-ray and Metrology for Smarter Process Control at JPCA 2026

May 2026 ― PEMTRON, an inspection equipment developer and supplier, will exhibit at the JPCA Show 2026, taking place June 10–12 at Tokyo Big Sight in Tokyo, Japan. Visitors can find PEMTRON at Booth No. 1A-14.

At the show, PEMTRON will highlight its JUPITER 3D X-ray Inspection System, designed to support both 2D and 3D inspection using PCT reconstruction-based processing. The system combines high-resolution imaging with AOI defect detection algorithms, allowing manufacturers to monitor processes in-line while also gaining deeper insight into production trends.

JUPITER also enables data sharing with SPI and AOI systems, giving users a more connected view of their inspection data and helping identify variations across the production line.

In addition, PEMTRON will present its POSEIDON metrology system, which focuses on precise measurement of wafer warpage, flatness, and FC-BGA bump coplanarity. These measurements are critical for advanced packaging processes, including wire bonding and Micro LED applications.

POSEIDON also detects fine surface defects such as microcracks, missing bumps, and bridging, allowing manufacturers to catch issues earlier and maintain tighter process control before downstream assembly steps.

By showcasing both inspection and metrology solutions, PEMTRON is focusing on giving manufacturers better visibility into their processes—from early-stage wafer analysis through final inspection.

For more information about PEMTRON, please visit www.pemtron.com.

About PEMTRON

Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies

Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS),  FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) and Lead Tab Process/Inspection equipment(Hawk 7300).