• 作者:
• 来源: MW Associates
• 日期: 2023-03-14
• 浏览次数: 771次

The demand for ultra-thin packages has increased, thus the reduction in package thickness has caused increased warpage. The warpage during the reflow process increases the gap between BGA components and solder paste, leading to HoP issues and production yield loss.
 

PF606-P130N features great flux activity that can prevent oxidation of solder powder during the reflow process. Furthermore, the new paste shows excellent solderability and hot slump performance to cover the warpage of components and prevent BGA/CSP HoP issues.

PF606-P130N is designed for the SMT process, especially for thin BGA package components.

For more information, please visit www.shenmao.com. 

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About SHENMAO

SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.